Benefiting from the upgrade of market consumption and the improvement of people’s requirements for driving experience, a smooth smart cockpit experience has gradually become a mainstream demand in the automotive market. In response to this trend, Quectel recently launched a new SiP packaged smart cockpit module AG855G. This product is developed based on Qualcomm’s third-generation automotive-grade smart cockpit chip SA8155P, which can support the higher computing power and smooth intelligent interaction level required by a new generation of smart cars, and easily meet the one-core multi-screen multi-system solution, including instrumentation, Multi-screen interaction such as entertainment host and head-up display (HUD), as well as intelligent configuration requirements such as vehicle-wide voice interaction, face recognition, gesture recognition, and Internet of Vehicles.
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Wang Min, general manager of Quectel’s vehicle business department, said: “With the accelerated popularization of automobile intelligence and electrification, the demand for multiple screens and intelligent interaction in the cockpit has ushered in explosive growth. While vehicle functions are constantly enriched, electronic systems It has also become more complex, which puts forward higher computing power requirements for automotive-grade modules and in-vehicle systems. The smart cockpit module AG855G we launched this time has excellent CPU, GPU, NPU and multimedia capabilities to meet the needs of in-vehicle Industry customers’ development requirements for high-performance, high-integration, and high-quality smart cockpits can bring better compatibility with Quectel connected products, reduce the workload of customer product adaptation, and bring more intelligence to end consumers. , a more stable and personalized smart cockpit experience.”
Top configuration, super computing power
The Qualcomm SA8155P chip carried by the Quectel smart cockpit module AG855G adopts the TSMC 7nm process, with excellent performance and rich experience in mass production. Under the empowerment of this platform, Quectel AG855G supports Android and QNX dual operating systems, an octa-core 64-bit processor, 1+3+4 three-cluster architecture, with a computing power of up to 100K DMIPS, and based on Hypervisor technology to achieve Android+QNX The dual-system environment, realizing a high degree of integration of all-digital instrumentation and central control entertainment, can ensure better integration and market competitiveness while ensuring the performance is strong enough.
The comprehensive AI computing power of AG855G can reach 8 TOPS, the powerful computing power can meet the AI interaction in the cockpit, and the more powerful NPU can also reduce the burden on the CPU and GPU, ensuring the smooth operation of other applications. At the same time, with the blessing of artificial intelligence, the smart cockpit can realize a more intelligent and personalized human-computer interaction experience in the cabin, such as face recognition, object recognition, gesture recognition, etc.