Quectel Wireless Solutions, a global IoT solutions provider, today unveils five modules designed to transform IoT with seamless Wi-Fi and Bluetooth connectivity and delivering performance, reliability and versatility, meeting diverse IoT needs around the world.
“We aim to redefine the landscape of short-range communications technology with this range of five different modules,” says Norbert Muhrer, President and CEO of Quectel Wireless Solutions. “From lightning-fast Wi-Fi to robust Bluetooth connectivity, our latest innovations promise unmatched performance, reliability and versatility. With compact designs designed to meet the requirements of size-sensitive applications, these modules enable IoT solutions around the world to reach new heights in connectivity and efficiency. »
The FCS866R and FCE863R are high-performance Wi-Fi 6 and Bluetooth 5.2 modules with 2T2R capabilities and in an LCC format package. These two modules are ideal for WLAN and Bluetooth connections, offering lightning-fast data rates of up to 1201 Mbit/s. With only 15.0 mm × 13.0 mm × 2.0 mm for the FCS866R and 15.0 mm × 13.0 mm × 2.2 mm for the FCE863R, both modules optimize the size and cost of the final products , thus responding perfectly to size-sensitive applications.
The FCS866R is designed with a reliable SDIO 3.0 interface to provide WLAN capability, realizing low-power and high-speed data transmission, while the FCE863R uses the reliable PCIe 1.1 interface to realize high-speed WLAN wireless transmission. speed and low consumption. The FCE863R can withstand industrial operating temperatures from -40 to approximately +85°C.
The FGS061N is another Wi-Fi 6 and Bluetooth 5.2 module, this time in an LGA package. Operating under the standard IEEE 802.11ax protocol, it supports MCS 0-MCS 11 rates in 80 MHz bandwidth, with 1024QAM support. Featuring a reliable SDIO 3.0 interface, it ensures seamless WLAN capability.
The FC906A is a robust Wi-Fi 5 and Bluetooth 5.2 module in an LCC format package. Designed to establish WLAN and Bluetooth connections, it operates in IEEE 802.11ac mode, supporting rates from MCS 0 to MCS 8 in 20 MHz channels and MCS 0 to MCS 9 in 40 MHz and 80 MHz channels. With 256QAM support, it achieves a maximum throughput of 433.3 Mbps, while ensuring compatibility with all throughputs specified in the IEEE 802.11a/b/g/n standards.
Equipped with a reliable SDIO 3.0 interface for WLAN capability, the FC906A includes 2.4 GHz and 5 GHz transmit power amplifiers and low noise amplifiers. As for Bluetooth, it complies with Bluetooth 5.2 standards and has a Class 1 power amplifier for extended range. It also supports Connection-Oriented Extended Synchronous Link (eSCO) for improved voice quality and Adaptive Frequency Hopping (AFH) to minimize radio frequency interference.
Finally, the FCS945R is a dual-band Wi-Fi 4 and Bluetooth 5.2 module designed for WLAN and Bluetooth connections. Operating in IEEE 802.11n mode, it reaches a maximum throughput of 150 Mbit/s. With its LCC form factor and ultra-compact package measuring just 12.0 mm × 12.0 mm × 2.15 mm, the FCS945R is optimized for size and cost, perfectly meeting the requirements of size-sensitive applications, and can withstand industrial operating temperatures of -40 to +85°C.
These five modules are available in LCC or LGA packages, while the surface mount technology (SMT), low profile and small size ensure they can all be easily integrated into size-constrained applications to provide connectivity reliable.
SOURCE: Businesswire