Super Micro Computer, Inc., a provider of complete IT solutions for AI, cloud, storage and 5G/Edge, announces the launch of a new, versatile, high-density infrastructure platform optimized for AI inferencing at the network edge. As enterprises look to incorporate complex large language models (LLM) into their daily operations, there is a need for new hardware capable of processing large amounts of data with minimal latency at the edge locations. Supermicro’s innovative system combines versatility, performance, and thermal efficiency to deliver up to 10 double-wide GPUs in a single system operating in traditional air-cooled environments.
“Thanks to the system’s optimized thermal design, Supermicro is able to deliver all of this performance in a high-density 3U 20 PCIe system with 256 cores that can be deployed in edge data centers,” said Charles Liang , president and CEO of Supermicro . “With the exponential growth of the AI market, customers need a powerful, versatile inference solution to run LLM-based applications on-premises, close to where the data is generated. Our new 3U Edge AI system enables them to run innovative solutions with minimal latency.”
The new SYS-322GB-NR features two powerful Intel® Xeon® 6900 processors with P-cores, 8800 MT/s MRDIMM, and up to 20 PCIe 5.0 expansion slots. This Supermicro system supports a variety of single- or double-width GPUs, or to utilize some of the expansion slots for high-performance I/O or other add-on cards. Additionally, the server features up to 6 TB of RDIMM memory and up to 14 E1.S or 6 U.2 NVMe drives.
One use case for this system is in the manufacturing industry, where Supermicro’s new system can be deployed on-site in an automated production environment to process data feeds from cameras and sensors without the need to transfer the data to a remote location. This option reduces network requirements and improves response times. Another environment where the SYS-322GB-NR will excel is in large-scale control rooms, where AI acceleration cards can be partially replaced with multi-display cards to support up to 64 independent displays.
Also Read: Airspan and Ecrio to Showcase AI-Driven Critical Communications
Supermicro op Mobile World Congress (MWC) Las Vegas
The SYS-322GB-NR will be on display at Supermicro’s booth #518 at MWC Las Vegas, October 8-10. Additionally, Supermicro systems powered by NVIDIA, AMD, and Intel Xeon 6 processors will be on display, including X14 edge and telco systems, including:
SYS-222HE-FTN – Hyper-E brings data center performance to the telco edge with dual Intel Xeon 6 processors in a 2U, short form factor with front I/O access
SYS-212B-FN2T – a 2U shallow depth system for AI in telco and edge deployments, featuring a single Intel Xeon 6700 series processor with E-cores and GPU support
SYS-E403- 14B -FRN2T – a wall-mounted box PC-sized peripheral that can bring the Intel Xeon 6700 series processor with E-cores and GPU support to remote environments
AS-1115S-FDWTRT – a 1U NEBS-compliant system delivering Telco performance for ORAN, Core and managed services. This system uses the AMD EPYC 8004 series processor and supports up to 1 single-width GPU accelerator for heavy workloads.
In addition to showcasing Supermicro hardware systems, in partnership with NVIDIA, Supermicro will jointly showcase inferencing and AI solutions for on-premises and Edge applications including Enterprise AI, Retail, Telco Edge, and Financial Services. Key generative AI solutions will be on display including NVIDIA NIM, NVIDIA NeMo, NVIDIA Metropolis, remote management, security, and networking. For Telecom, Supermicro and NVIDIA will demonstrate a live AI RAN solution featuring NVIDIA and Supermicro solutions showcasing performance, management, and AI use cases.
Also on display at MWC Las Vegas is Supermicro and Intel’s new joint solution that combines the rugged IP65 Outdoor Edge System with a built-in AI network accelerator and Intel® Data Center GPU Flex 170. This solution enables multiple private 5G networks and Edge AI applications in a single device to be deployed quickly and cost-effectively. Multiple users can deploy and operate the networks, providing a scalable solution for dense environments such as industrial and campus sites, venues, and smart cities.
Source: PRNewswire