Telit Cinterion has announced its next-generation 5G data cards and LGA modules, integrating Qualcomm’s Snapdragon® X72 5G Modem-RF System to enhance consumer and enterprise devices. The Snapdragon X72, equipped with AI hardware acceleration, is designed to drive the future of 5G in mobile broadband applications. The new product line includes a global M.2 data card and two LGA modules tailored for North America and the combined regions of Asia-Pacific, Europe, the Middle East, Africa, and South America. These modules offer peak download speeds of 4.4 Gbps and upload speeds of 3.5 Gbps, making them ideal for applications such as fixed wireless access, mobile broadband, industrial IoT, private 5G networks, and 4K video streaming. Support for OpenWRT ensures seamless integration of advanced networking features across various routers, gateways, and customer premises equipment (CPE) for both residential and enterprise use.
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The Snapdragon X72 introduces a scalable modem-RF architecture with a converged mmWave-sub6 design and the Qualcomm® QTM565 mmWave antenna module, reducing hardware footprint, cost, design complexity, and power consumption. Anand Venkataraman, Director of Product Management at Qualcomm Technologies, Inc., stated, “Snapdragon X72 is designed to drive the next phase of 5G evolution enabled by advanced 5G features, which will help Telit Cinterion customers future-ready their devices.” Marco Contento, VP of Product Management, Mobile Broadband at Telit Cinterion, added, “We’re continuing that tradition by making the Snapdragon X72 our foundation for Telit Cinterion’s new portfolio of 5G data cards and LGA modules which will raise the bar for what’s possible and preferable in mobile-powered devices such as routers, gateways and CPEs.”