Super Micro Computer, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, continues to offer IT solutions for decreasing the environmental impact of modern data center. Supermicro is advancing technology in critical areas such as product design, green computing, manufacturing, and rack scale integration which enables organizations to become productive and reduce energy consumption quickly.
“Our Green Computing focus enables Supermicro to design and manufacture state-of-the-art servers and storage systems with the latest CPU and GPU technologies from NVIDIA, Intel, and AMD that reduce power consumption,” said Charles Liang, president and CEO of Supermicro. “Our innovative rack scale liquid cooling option enables organizations to reduce data center power usage expenses by up to 40%.
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Our popular GPU Servers with the NVIDIA HGX H100 8-GPU server continue to be in demand for AI workloads. We are expanding our solution offerings with innovative servers that use the NVIDIA Grace CPU Superchip and are working closely with NVIDIA to bring energy-efficient servers to market for AI and other industries. Worldwide our manufacturing capacity is 4,000 racks and more than 5,000 later this year.”
Supermicro has the most comprehensive portfolio to support AI workloads and other verticals. These innovative systems include single and dual-socket rack mount systems based on 4th Gen Intel Xeon Scalable processors and 4th Gen AMD EPYC processors in 1U, 2U, 4U, 5U, and 8U form factor supporting 1-10 GPUs as well the density-optimized SuperBlade® systems supporting 20 NVIDIA H100 GPUs in an 8U enclosure, and SuperEdge systems designed for IoT and edge environments. The newly announced E3.S Petascale storage systems offer significant performance, capacity, throughput, and endurance when training on very large AI datasets while keeping excellent power efficiencies.
A new product family built on the NVIDIA Grace CPU Superchip will be available soon. These new servers will each contain 144 cores with dual CPUs joined by a 900GB/sec connection, allowing for highly responsive AI applications and those requiring extremely low latency responses. With the CPU running at 500W TDP, this system will reduce energy consumption for cloud-native workloads and the next generation of AI applications.
SOURCE: PR Newswire